胡鸿

创建时间:  2024/09/04  梁洁   浏览次数:   

Team Members

Hong Hu, Associate Professor

Email: honghu@shu.edu.cn

Personal Profile:

Hong Hu specializes in the manufacturing of surface functional micro/nanostructures, design of flexible wearable electronic devices, and the fundamental issues of solid mechanics involved in these areas. He has published more than 30 SCI-indexed papers, holds three patents, and has established long-term collaborations with major state-owned enterprises such as China Electronics Technology Group Corporation and China National Offshore Oil Corporation.

Research Direction:

Manufacturing of surface functional structures, flexible electronics, multi-scale mechanics

Educational Background:

PhD in Mechanical Engineering and Automation, Xi'an Jiaotong University, 2017

BEng in Mechanical Engineering and Automation, South China University of Technology, 2010

Work Experience:

Associate Professor, Shanghai University, May 2023 - Present

Postdoctoral Researcher/Senior Research Assistant, The Hong Kong Polytechnic University, Apr. 2018 – Dec. 2022

Scientific research achievements and awards:

First Prize, Shaanxi Province Natural Science Award, ranked 4/6 (2024)

Shanghai High-Level Overseas Talent Introduction Plan (2023)

Special Prize in Science and Technology at Institutions of Higher Education in Shaanxi Province, ranked 4/11 (2023)

First Prize in Science and Technology at Institutions of Higher Education in Shaanxi Province, ranked 5/7 (2022)

Outstanding PhD Thesis, Xi'an Jiaotong University (2020)

Bronze Award for the 8th "Shangyin" Excellent Mechanical Doctoral Dissertation (2018)

Published over 30 articles in prestigious international journals such as Sci. Adv., Adv. Funct. Mater., ACS Nano, and J. Mech. Phys. Solids, including 12 as the first author and 2 as the corresponding author.

Representative Results:

1.D. Wang#, H. Hu#, S. Li, H. Tian*, W. Fan, X. Li, X. Chen, A. C. Taylor, J. Shao*, “Sensing-triggered stiffness-tunable smart adhesives”, Sci. Adv., 9, eadf4051 (2023).

2.H. Hu, X. Guo, Y. Zhang, Z. Chen, L. Wang, Y. Gao, Z. Wang, Y. Zhang, W. Wang, M. Rong, G. Liu, Q. Huang, Y. Zhu, Z. Zheng*, “Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics”, ACS Nano, 17, 3921 (2023).

3.H. Hu, H. Tian, Y. Gao, Z. Wan, L. Wang, H. Xu, C. Wang, J. Shao*, Z. Zheng*, “Revisiting the contact splitting hypothesis: An effective route for enhancing adhesion on rough surface”, J. Mech. Phys. Solids, 170, 105121 (2023).

4.H. Hu, D. Wang, H. Tian, Q. Huang, C. Wang, X. Chen, Y. Gao, X. Li, X. Chen, Z. Zheng*, J. Shao*, “Bioinspired Hierarchical Structures for Contact‐Sensible Adhesives”, Adv. Funct. Mater., 32, 2109076 (2023).

5.H. Hu, S. Zhao, W. Wang, Y. Zhang, Y. Fu, Z. Zheng*, “Prediction of adhesion between randomly rough surfaces by order statistics”, Appl. Phys. Lett., 19, 071603 (2021).

上一条:郑乐

下一条:梁洁